Introduction to Test Fixtures
MCPi provides comprehensive socket and functional fixture solutions for semiconductor testing—such as AI and 5G chips—spanning from software/hardware design to micron-level production. We design high-precision test sockets for BGA and IC packages, precisely integrating Pogo Pins to ensure excellent electrical performance under long-term compression. Utilizing advanced multi-axis equipment for micron-level micro-hole drilling, we satisfy the stringent requirements of fine-pitch, high-density pin arrays. Our R&D team flexibly integrates software control, signal routing, and automated pneumatic mechanisms to deliver advanced PCBA test fixtures.
Specializing in PEEK and POM machining, we combine on-machine measurement with CMM inspection to maintain geometric concentricity within 5 μm, ensuring highly agile responses to product engineering changes.
MCPi provides comprehensive test socket and high-end fixture solutions for AI and 5G chip testing, integrating hardware/software co-design, reverse engineering, and micron-level machining. We utilize high-precision scanning to restore dimensions of components without original 3D drawings, successfully achieving localized substitution. We design high-precision test sockets for BGA and IC packages, precisely integrating Pogo Pins to ensure excellent electrical connectivity under long-term compression. Through advanced multi-axis equipment, our manufacturing process implements a "single-setup" approach for micron-level micro-hole drilling, fully satisfying the requirements of fine-pitch, high-density pin arrays. Our R&D team deploys software simulations for motion and interference analysis during the initial phase to eliminate design errors from the source. Specializing in the machining of PEEK, POM, and anti-static materials, we combine on-machine measurement with CMM verification to strictly control geometric concentricity within ≤ 5 μm, ensuring highly agile responses to product changes while significantly reducing re-tooling costs.
MCPi provides high-end socket solutions for AI and 5G chip testing, driven by advanced reverse engineering and micron-level machining. We master fine-pitch micro-hole machining, precisely drilling micro-diameters (down to 0.1mm) in high-hardness materials or specialized engineering plastics to ensure smooth probe movement without deflection. Our facility excels in the cutting and deformation control of PEEK, ceramics, tungsten steel, and ESD anti-static materials, preventing dielectric breakdown and ensuring no structural deformation over hundreds of thousands of compressions. During the design phase, DFM is deployed to optimize paths and mitigate high-frequency signal interference, paired with a uniform-compression mechanism to prevent pin damage. Combining on-machine measurement with CMM verification, we strictly control geometric concentricity within ≤5 μm. When facing ECN changes, we deliver rapid localized re-tooling or calibration, significantly saving costs for our clients.
MCPi specializes in the manufacturing of high-end test sockets for AI and 5G chip testing. We master fine-pitch micro-hole machining, precisely drilling 0.2mm micro-holes in PEEK and ceramics while strictly controlling geometric concentricity within ≤5 µm to ensure smooth probe movement without deflection. Our facility excels in the cutting of ESD anti-static materials to prevent chip dielectric breakdown. During the design phase, DFM is deployed to optimize paths and mitigate high-frequency signal interference, paired with a uniform-compression mechanism to prevent pin damage. Combined with high-precision reverse engineering, we can rapidly reconstruct components lacking original drawings. When facing ECN design changes, we offer the agility for swift localized re-tooling and consumable replacement, significantly saving costs for clients and maintaining maximum production line utilization.